Vapor chamber thermal strap assembly and method
US11662154B2 · kind B2 · utility
1Cited by
6References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2020 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | May 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3737
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer system includes a first vapor chamber, a second vapor chamber spaced from the first vapor chamber, and a flexible thermal strap disposed between and coupled to both the first vapor chamber and the second vapor chamber. The flexible thermal strap permits the second vapor chamber to rotate relative to the first vapor chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.