Pressure measuring apparatus for measuring a discharge pressure of a liquid discharged onto a wafer
US11662264B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2019 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Jan 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure measuring apparatus for measuring a jetting pressure of a liquid jetted from a nozzle includes a plate including: a first surface facing the nozzle; and a second surface opposite to the first surface; a pressure sensor configured to detect a discharge position and the discharge pressure at the discharge position of the liquid and generate a signal based on the discharge pressure; and electrical components including a controller configured to receive the signal and collect data regarding the discharge pressure. The pressure sensor is provided on the first surface of the plate and the electrical components are provided on the second surface of the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.