Apparatus, system, and method for integrating conductive coil with injection-molded housing
US11662871B1 · kind B1 · utility
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20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2022 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | May 13, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q7/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The disclosed coil-integrated housing component may include an injection-molded housing dimensioned to house a display module of a computing device. Additionally, the coil-integrated housing component may include a conductive coil integrated into the injection-molded housing to surround a periphery of the display module, wherein the conductive coil may be electronically coupled to the computing device. Various other apparatuses, systems, and methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.