Patent · US Active

Encapsulation system for electronic components and batteries

US11664550B2 · kind B2 · utility

0Cited by
1References
17Claims
0Family size

Assignee

Inventor

Key dates

Filing dateAug 2, 2022
Grant dateMay 30, 2023
Priority date—
Expiry dateAug 2, 2042

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Systems, methods, and apparatus for encapsulating objects like that of microelectronic components and batteries. The system includes three successive layers that include a first covering layer composed of an electrically insulating material deposited by atomic layer deposition, which at least partly covers the object, a second covering layer that includes parylene and/or polyimide, and which is disposed on the first covering layer, and a third covering layer deposited on the second covering layer in such a way as to protect the second encapsulation layer, namely, with respect to oxygen, and thereby increase the service life of the object.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.