Circuit board, method for manufacturing circuit board, and electronic device
US11665816B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2020 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | May 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.