Method for manufacturing a circuit board with embedded nickel resistor
US11665831B2 · kind B2 · utility
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4References
7Claims
0Family size
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Key dates
| Filing date | Sep 22, 2020 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Jun 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1461
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a circuit board with nickel resistor embedded therein provides a copper substrate, the copper substrate includes a copper foil. A nickel resistance layer is formed on the copper foil. A first dielectric layer and a first copper layer are formed on the nickel resistance layer. The copper foil and the first copper layer are etched to form a first conductive wiring layer and a second conductive wiring layer respectively, the nickel layer not being subjected to an etching process, to obtain the finished circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.