Electronic device having flexible, heat conductive layer and associated methods
US11665856B2 · kind B2 · utility
1Cited by
16References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2021 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Dec 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4275
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.