Cooling computing modules of a rack-mountable tray
US11665862B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2021 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Jul 25, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An information handling system, including a plurality of computing modules; a rack-mountable tray including: a plurality of bays, each bay including a thermal pad, wherein i) each computing module is engaged with one or more of the bays of the plurality of bays and ii) one or more of the thermal pads are in thermal communication with a respective computing module of the plurality of computing modules; and a fluid circulation system positioned within the tray and coupled to each of the thermal pads, the fluid circulation system circulating fluid proximate to the thermal pads to transfer heat from the computing modules through the thermal pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.