Immersion cooling system and electronic apparatus having the same
US11665864B2 · kind B2 · utility
0Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2021 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Dec 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.