Medical device lead connection assembly
US11666767B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2017 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Aug 18, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of forming a medical device lead connection element is described. The method includes positioning an end portion of a lead filar to overlap a lead end connection element such that the positioning creates mutual interference between the lead filar and the lead end connection element, and forming an interference configuration. Then melting the end portion of the lead filar to form a weld joint and allowint the end portion of the lead filar to move towards the end connection element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.