Method of forming leveraged poromeric polishing pad
US11667061B2 · kind B2 · utility
0Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2020 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Jan 20, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2375/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention provides a method of forming porous polyurethane polishing pad that includes feeding liquid polyurethane onto a web sheet with a doctor blade while back tensioning the web. Coagulating liquid polyurethane onto the web sheet forms a two-layer substrate. The two-layer substrate has a porous matrix wherein the porous matrix has large pores extending upward from a base surface and open to an upper surface. Spring-arm sections connect lower and upper sections of the large pores.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.