MEMS device having uniform contacts
US11667516B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2020 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Jul 17, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00158
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of forming a microelectromechanical device wherein a beam of the microelectromechanical device may deviate from a resting to an engaged or disengaged position through electrical biasing. The microelectromechanical device comprises a beam disposed above a first RF electrode and a second RF electrode. The microelectromechanical device further comprises one or more electrical contacts disposed below the beam. The one or more electrical contacts comprise a first layer of ruthenium disposed over an oxide layer, a titanium nitride layer disposed on the first layer of ruthenium, and a second layer of ruthenium disposed on the titanium nitride layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.