Latex composition for dip molding, method of preparing the same, and dip-molded article produced using the same
US11667773B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Aug 21, 2020 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Jan 1, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2309/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A latex composition for dip molding having an excellent flow mark property and syneresis property and being capable of providing a molded article having excellent tensile properties and texture is provided. A method of preparing the latex composition, and a dip-molded article produced using the latex composition are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.