Encapsulating or filling composition for electronic devices and electronic apparatus
US11667786B2 · kind B2 · utility
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1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2021 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Jul 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/846
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are an encapsulating or filling composition for electronic devices and an electronic apparatus. The encapsulating or filling composition includes a curable material containing an epoxy group, a polymerization initiator, and a metal catalyst. The electronic apparatus includes a first substrate, an electronic device disposed on the first substrate, and one or more cured materials of the encapsulating or filling composition formed on the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.