In-cutter sensor LWD tool and method
US11668185B2 · kind B2 · utility
1Cited by
20References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2021 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Apr 30, 2041 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B47/26
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
An instrumented cutter including a polycrystalline diamond table bonded to a substrate with a sensor, for monitoring the condition of the polycrystalline compact diamond table, embedded in the substrate. Further the instrumented cutter includes a wireless transmitter equipped with a power supply to power to the wireless transmitter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.