Radio-frequency loss reduction in photonic circuits
US11668994B2 · kind B2 · utility
1Cited by
23References
20Claims
0Family size
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Key dates
| Filing date | Mar 16, 2021 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Sep 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F71/127
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In photonic integrated circuits implemented in silicon-on-insulator substrates, non-conductive channels formed, in accordance with various embodiments, in the silicon device layer and/or the silicon handle of the substrate in regions underneath radio-frequency transmission lines of photonic devices can provide breaks in parasitic conductive layers of the substrate, thereby reducing radio-frequency substrate losses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.