Wiring harness assembly having multiple separated conductors embedded within a substrate
US11670434B2 · kind B2 · utility
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22References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2022 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Mar 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/26
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a wiring harness assembly includes the steps of forming a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, forming an opening in the substrate located and sized such that a section of the plurality of electrically conductive wires is exposed within the opening, disposing a support segment within the opening, securing a connector segment including a plurality of terminals to the support segment, and placing the plurality of terminals in mechanical and electrical contact with the plurality of electrically conductive wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.