Assembly and method for sealing a bundle of wires
US11670437B2 · kind B2 · utility
0Cited by
35References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2022 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Jan 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02G15/013
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A structure for creating a sealed wire bundle includes a first adhesive material in the form of a circular or semi-circular shape. The first adhesive material has a first outer wall with first spoke arms extending inward from the first outer wall. The first adhesive material has a first viscosity. First wire receiving spaces are provided between the first spoke arms. Wires are positioned in the first wire receiving spaces. As heat is applied to the adhesive structure, the adhesive structure flows to fill voids between the plurality of wires to thereby seal the wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.