Patent · US Active

Double-sided copper-clad laminate

US11670455B2 · kind B2 · utility

1Cited by
2References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 4, 2021
Grant dateJun 6, 2023
Priority date
Expiry dateJun 4, 2041

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01G4/40
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

There is provided a double-sided copper-clad laminate for forming a capacitor that can exhibit excellent properties in voltage endurance and peel strength, while ensuring high capacitor capacity, when used as a capacitor. This double-sided copper-clad laminate includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.