Electronic device and method of manufacturing an electronic device
US11670570B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 2020 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Jun 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1443
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.