Fabric die to fabric die interconnect for modularized integrated circuit devices

US11670589B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Chee Hak Teh · Kampung Bukit Kechil, MY
• Chee Seng Leong · Air Itam, MY
• Lai Guan Tang · Bayan Lepas, MY
• Han Wooi Lim · Bayan Lepas, MY
• Hee Kong Phoon · Bagan Serai, MY

Key dates

• Filing date: Dec 22, 2020
• Grant date: Jun 6, 2023
• Expiry date: Jul 30, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15192
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.