Semiconductor package structure
US11670596B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2021 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Mar 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package structure includes a substrate, a first redistribution layer, a second redistribution layer, a bridge structure, a first semiconductor component, and a second semiconductor component. The first redistribution layer is over the substrate. The second redistribution layer is over the first redistribution layer. The bridge structure is between the first redistribution layer and the second redistribution layer, wherein the bridge structure includes an active device. The first semiconductor component and the second semiconductor component are located over the second redistribution layer, wherein the first semiconductor component is electrically coupled to the second semiconductor component through the second redistribution layer and the bridge structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.