Patent · US Active

Method for producing optoelectronic semiconductor components, and optoelectronic semiconductor component

US11670745B2 · kind B2 · utility

0Cited by

1References

17Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Klaus Reingruber · Langquaid, DE
Andreas Reith · Bogen, DE
Tobias Gebuhr · Regensburg, DE

Key dates

Filing date	Jul 18, 2018
Grant date	Jun 6, 2023
Priority date	—
Expiry date	Sep 22, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0362
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing optoelectronic semiconductor components may include applying optoelectronic semiconductor chips for generating radiation to a carrier, producing a potting around the semiconductor chips with a potting top side facing away from the carrier such that the semiconductor chips remain free of a reflective potting material. The potting has trenches between the semiconductor chips, and the trenches are arranged at a distance from the semiconductor chips; the trenches do not touch the semiconductor chips. The method may further include filling the trenches with a supporting material to form at least one supporting body and leaving the potting alongside the trenches free of the supporting material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.