Photonic component
US11670909B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2017 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Sep 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to a photonic component (1) having at least one semiconductor laser amplifier (200), which has at least one first mirror surface (210a) for coupling and/or decoupling optical radiation (S). The first mirror surface (210a) of the semiconductor laser amplifier (200) is coupled to a photonically integrated chip (100), wherein the chip (100) is arranged such that the chip can emit optical radiation (S) from the chip top side (O100) thereof in the direction of the first mirror surface (210a) and couple said radiation in the semiconductor laser amplifier (200), and wherein the emitting of the radiation (S) away from the chip top side (O100) occurs in the direction of the first mirror surface (210a) at an angle of 90°±20°, in particular perpendicular, to the chip top side (O100).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.