Parylene electret condenser microphone backplate
US11671763B2 · kind B2 · utility
0Cited by
13References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2021 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Mar 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone assembly comprising a housing, a single flexible diaphragm, and a rigid backplate. The backplate may be coated with a parylene configured to help reduce the flatness deviation of the backplate across the diameter of the backplate. A plurality of openings may extend from the top portion of the backplate to the bottom portion of the backplate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.