Method of manufacturing composite circuit board
US11672083B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Oct 8, 2021 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Dec 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0228
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.