Patent · US Active

Chassis with thermal transfer fluid path

US11672106B2 · kind B2 · utility

0Cited by

9References

18Claims

0Family size

Assignee

Hamilton Sundstrand Corporation (HSC) · US

Inventors

Jason C. Duffy · Jefferson, US
Kenneth J. Trotman · Granby, US

Key dates

Filing date	Jun 28, 2021
Grant date	Jun 6, 2023
Priority date	—
Expiry date	Sep 18, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/20636
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.