Microstructure and method for manufacturing same
US11673797B2 · kind B2 · utility
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3References
11Claims
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Key dates
| Filing date | Mar 4, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Aug 17, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0181
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microstructure and a method for manufacturing the same includes: disposing a liquid film on a surface of a substrate, wherein a solid-liquid interface is formed where the liquid film is in contact with the substrate; and irradiating the substrate with a laser of a predetermined waveband to etch the substrate at the solid-liquid interface, wherein the position where the laser is irradiated on the solid-liquid interface moves at least along a direction parallel to the surface of the substrate, and the absorption rate of the liquid film for the laser is greater than the absorption rate of the substrate for the laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.