Highly loaded inorganic filled aqueous resin systems
US11674030B2 · kind B2 · utility
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11References
27Claims
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Key dates
| Filing date | Nov 29, 2018 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Sep 19, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/005
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This disclosure provides A resin system comprising (1) a resin including (i) 1-30 wt % of a binder comprising an aqueous-soluble, photopolymerizable monomer, oligomer, or polymer, (ii) 1-20 wt % of an emulsion component; and (ii) from greater than 0 to 10 wt % of a photoinitiator, and (2) 41-90 wt % of a filler including glass or glass ceramic particles wherein the particles have an average size along their longest dimension of from 5 nm to 20 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.