Method and apparatus for mounting optical components
US11675152B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2014 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Jun 28, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B7/1822
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and apparatus for mounting optical components is described. The apparatus (1) is suitable for mounting multiple optical components (2) and comprises a baseplate (3) having opposing first (4) and second (5) surfaces. Recesses or apertures (7) are formed within the baseplate and are located upon the first or second surfaces so as to define thermally activated optic mounting areas. Pillars (13) are then located within the thermally activated optic mounting areas and these provide a means for attaching the optical component to the baseplate (3). The employment of the recesses or apertures act to significantly reduce the thermal conduction throughout the baseplate. As a result preferential heating can be provided to the one or more thermally activated optic mounting areas while maintaining the baseplate with a desired mechanical strength. The optical mounting apparatus exhibits a high thermal stability thus making the apparatus ideally suited for use within commercial optical system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.