Semiconductor package having sealant bridge

US11676873B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Dinesh Padmanabhan Ramalekshmi Thanu · Chandler, US
• Hemanth K. Dhavaleswarapu · Chandler, US
• Venkata Suresh R. Guthikonda · Chandler, US
• John J. Beatty · Chandler, US
• Yonghao An · San Diego, US
• Marco Aurelio Cartas Ayala · Chandler, US
• Luke Garner · Chandler, US
• Peng Li · Beijing, CN

Key dates

• Filing date: Jun 30, 2017
• Grant date: Jun 13, 2023
• Expiry date: Jun 30, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19105
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Semiconductor packages having a sealant bridge between an integrated heat spreader and a package substrate are described. In an embodiment, a semiconductor package includes a sealant bridge anchoring the integrated heat spreader to the package substrate at locations within an overhang gap laterally between a semiconductor die and a sidewall of the integrated heat spreader. The sealant bridge extends between a top wall of the integrated heat spreader and a die side component, such as a functional electronic component or a non-functional component, or a satellite chip on the package substrate. The sealant bridge modulates warpage or stress in thermal interface material joints to reduce thermal degradation of the semiconductor package.