Patent · US Active

Thermoelectric coolers combined with phase-change material in integrated circuit packages

US11676883B2 · kind B2 · utility

1Cited by

3References

23Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Javed Shaikh · Kanchinakote, IN
Je-Young Chang · San Jose, US
Kelly Lofgreen · Phoenix, US
Weihua Tang · Chandler, US
Aastha Uppal · Chandler, US

Key dates

Filing date	Mar 15, 2019
Grant date	Jun 13, 2023
Priority date	—
Expiry date	Oct 10, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH10N10/853
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.