Electronic device including electrical connections on an encapsulation block
US11676928B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 6, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Dec 8, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.