Printed wiring board and method for manufacturing printed wiring board
US11678440B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2020 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Mar 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board includes a resin insulating layer, a metal post formed in the insulating layer and protruding from first surface of the insulating layer, a conductor layer formed on second surface of the insulating layer, and a via conductor penetrating through the insulating layer and connecting the metal post and conductor layer. The metal post has a protruding portion protruding from the first surface of the insulating layer and an embedded portion connected to the protruding portion and embedded in the insulating layer such that the protruding portion does not extend onto the insulating layer, and the metal post has upper and side surfaces such that the side surface has unevenness including a first unevenness on side surface of the protruding portion and a second unevenness formed on side surface of the embedded portion and having a size that is larger than a size of the first unevenness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.