Loading mechanism with integrated heatsink
US11678444B2 · kind B2 · utility
0Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2019 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Dec 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4075
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Examples described herein relate to a tool-less manner of forming an assembly with a circuit board carrier enclosure that provide leaf springs that provide a force against a circuit board to maintain a level surface of the circuit board. Multiple leaf springs can be used to apply a desired force to the circuit board. A heat sink can be mounted in the enclosure at a distance from the circuit board. The circuit board with carrier can be inserted without tools into an electrical connection for communications with other devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.