Heat sink for optical module

US11678466B2 · kind B2 · utility

Assignee

• Cisco Technology, Inc. · US

Inventors

• Rohit Dev Gupta · Bengaluru, IN
• Narasimha Reddy Emmareddy · Kanchinakote, IN
• Manjunatha Reddy Shivashankara · Kanchinakote, IN
• Suresh Kumar Vadivazhagan · Kanchinakote, IN
• Giovanni Giobbio · Rovellasca, IT

Key dates

• Filing date: May 24, 2021
• Grant date: Jun 13, 2023
• Expiry date: Aug 19, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4278
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.