Assembling device
US11679457B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2020 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Aug 27, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5138
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An assembling device includes a holding member and a processing device. The holding member is configured to hold a first assembly component and a second assembly component. The processing device is configured to process a first excess thickness portion and a second excess thickness portion. The first excess thickness portion is provided at the first assembly component and is configured to adjust a gap between the first assembly component and the second assembly component. The second excess thickness portion is provided at the second assembly component and is configured to adjust the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.