Chemical mechanical polishing pad and preparation thereof
US11679531B2 · kind B2 · utility
1Cited by
9References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 13, 2021 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Jan 14, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/736
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is prepared by extruding a compounded photopolymerizable composition followed by exposure to UV light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.