Reservoir with substrate assembly for reducing separation forces in three-dimensional printing
US11679555B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2021 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Jan 18, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y30/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention concerns a system and reservoir assembly for three-dimensional (3D) printing. The reservoir assembly includes a top frame that may be filled with liquid material, and a tensioned film being held underneath the top frame. The tensioned film may be air permeable and flexible, wherein surfaces of the tensioned film may be micro textured. A bottom frame is coupled to the top frame and secures a transparent or semi-transparent rigid substrate. A permeable substrate is sandwiched between the tensioned film secured to the top frame and the transparent or semi-transparent rigid substrate secured to the bottom frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.