Mechanical microsystem and associated manufacturing method
US11679974B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2020 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Jan 28, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0132
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A mechanical microsystem including a pair of elastically deformable elements, a mechanical hinge joining the deformable elements together, and at least two electroactive layers. The microsystem is configured such that, from a rest position wherein the deformable elements fall into a plane, a deformation of one of the deformable elements displacing it outside of the plane induces an electric current circulation in one of the two electroactive layers, and/or conversely. Each deformable element has a front face and a rear face opposite one another and substantially parallel to the plane. A first electroactive layer is arranged together with a first deformable element on its rear face, and a second electroactive layer, different from the first layer, is arranged with a second deformable element, different from the first element, on its front face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.