Patent · US Active

Hierarchical heat exchanger manifold and heat exchanger including the same

US11680756B2 · kind B2 · utility

0Cited by

0References

24Claims

0Family size

Assignee

HRL Laboratories, LLC · US

Inventors

Christopher S. Roper · Oak Park, US
John H. Martin · Los Angeles, US
Randall Schubert · Santa Monica, US

Key dates

Filing date	Jul 15, 2020
Grant date	Jun 20, 2023
Priority date	—
Expiry date	Nov 13, 2040

Classification

Technology area (CPC F)Mechanical Engineering; Lighting; Heating
CPC primaryF28F2210/02
WIPO fieldThermal processes and apparatus
WIPO sectorMechanical engineering

Abstract

A hierarchical heat exchanger manifold includes: first and second fluid passages respectively open to an inlet and an outlet in a first level of the heat exchanger manifold; a plurality of first and second fluid passages in a second level of the heat exchanger manifold; and a plurality of first and second fluid passages in a third level of the heat exchanger manifold. A number of the first fluid passages in the third level is greater than a number of the first fluid passages in the second level. Each of the first fluid passages in the second level is in fluid communication with the inlet and at least one of the first fluid passages in the third level, and each of the second fluid passages in the second level is in fluid communication with the outlet and at least one of the second fluid passages in the third level.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.