Semiconductor burn-in oven chamber sealing
US11680980B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2021 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Sep 16, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2862
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor burn-in oven includes a housing including a burn-in chamber and an opening to the burn-in chamber surrounded by a front face, a heating device, testing circuitry, a door and a sealing mechanism. The door has an open position, in which the burn-in chamber is accessible through the opening, and a closed position, in which the door covers the opening. The sealing mechanism is configured to form a seal around the opening between an interior side of the door and the front face when the door is in the closed position. The sealing mechanism includes at least one sealing member having a recessed position, in which a gap extends between the front face and the interior side of the door, and a sealing position, in which the at least one sealing member closes the gap and forms the seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.