Patent · US Active

Reliable through-silicon vias

US11682465B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

ATI Technologies ULC · CA

Inventors

Zheng Gong · Hefei, CN
Jiao Wang · Munich, DE
Zhenhua Yang · Chengdu City, CN

Key dates

Filing date	Sep 30, 2021
Grant date	Jun 20, 2023
Priority date	—
Expiry date	Sep 30, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH10B20/25
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

An integrated circuit includes a TSV extending from a first surface of a semiconductor substrate to a second surface of the semiconductor substrate and having a first end and a second end, and a non-volatile repair circuit. The non-volatile repair circuit includes a one-time programmable (OTP) element having a programming terminal, wherein in response to an application of a fuse voltage to the programming terminal, the OTP element electrically couples the first end of the TSV to the second end of the TSV.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.