Method and device for etching patterns inside objects
US11682550B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2020 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Dec 25, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and methods for etching complex patterns on an interior surface of a hollow object are disclosed. A method generally includes positioning a laser system within the hollow object with a focal point of the laser focused on the interior surface, and operating the laser system to form the complex pattern on the interior surface. Motion of the laser system and the hollow object is controlled by a motion control system configured to provide rotation and/or translation about a longitudinal axis of one or both of the hollow object and the laser system based on the complex pattern, and change a positional relationship between a reflector and a focusing lens of the laser system to accommodate a change in distance between the reflector and the interior surface of the hollow object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.