Devices for fabrication of shielded modules
US11682585B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2018 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Dec 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Devices for fabrication of shielded modules. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.