Semiconductor with integrated electrically conductive cooling channels
US11682606B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2019 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Sep 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor assembly includes a power semiconductor, a housing containing the power semiconductor, and electrically conductive channels. The electrically conductive channels are arranged to direct coolant through the housing. Heat generated by the power semiconductor can therefore be absorbed by the coolant. The electrically conductive channels are also electrically connected with the power semiconductor to form terminals for the power semiconductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.