Patent · US Active

Encapsulated printed circuit board assembly

US11683880B2 · kind B2 · utility

1Cited by

4References

15Claims

0Family size

Assignee

3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

Gunther Stollwerck · Krefeld, DE
Mark Gravermann · Erkelenz, DE
Jens Weichold · Erkelenz, DE
Sebastian Eggert-Richter · Wülfrath, DE
Michael H. Stalder · Neuss, DE

Key dates

Filing date	Oct 16, 2019
Grant date	Jun 20, 2023
Priority date	—
Expiry date	Jul 31, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1327
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.