Modular electrical fieldbus system with stacked interconnected functional components
US11683901B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2017 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Feb 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R9/2616
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A modular electrical bus system for a valve manifold has a communication module, a valve driver module, and a plurality of I/O modules each having a plurality of I/O fittings being both electrically and mechanically connectable together via a bridge member connecting adjacent modules. The bridge member has a housing with an interior for housing electronic components for memory storage or Wi-fi reception and transmission that is operably connected to a complementary electrical fitting constructed to be connected to an electrical fitting of a module of said electrical fieldbus system without adding extra length to said bank of modules of said electrical fieldbus system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.