Apparatus for cooling electronic circuitry
US11683907B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2021 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Jan 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.