Patent · US Active

Lithography for fabricating Josephson junctions

US11683995B2 · kind B2 · utility

0Cited by

5References

19Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Kenneth P. Rodbell · Sandy Hook, US
Leonidas E. Ocola · Oswego, US
Charles Thomas Rettner · San Jose, US
Mary E. Rothwell · Ridgefield, US
Elbert E. Huang · Carmel, US

Key dates

Filing date	Aug 3, 2020
Grant date	Jun 20, 2023
Priority date	—
Expiry date	Nov 5, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH10N60/805
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Techniques regarding lithographic processes for fabricating Josephson junctions are provided. For example, one or more embodiments described herein can comprise a method that can include depositing a first resist layer onto a second resist layer. The first resist layer can include a bridge portion that defines an opening for forming a Josephson junction. The method can also comprise depositing a third resist layer onto the bridge portion. The third resist layer can shield the opening from an angled deposition of a superconducting material during fabrication of the Josephson junction.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.